The industrial electronics and Edge AI sector is constantly searching for compact, powerful, and robust solutions. In this context, ARIES Embedded has introduced the MSRZG3E, a sophisticated System in Package (SiP) that stands out for its integration of the Renesas RZ/G3E microprocessor (MPU) and its compliance with the Open Standard Module (OSM) standard.
Designed specifically for applications requiring high graphics performance and local AI inference capabilities, the ARIES MSRZG3E positions itself as a ideal solution for industrial human-machine interfaces (HMIs) mid-range, medical equipment and advanced automation systems.
Dual-Core Processing Architecture and AI Acceleration
At the heart of the MSRZG3E lies the MPU Renesas RZ/G3E, which provides a versatile and powerful processing architecture to handle both high-level and real-time tasks:
- SoC:
- Renesas RZ/G3E
- Arm Cortex-A55 Dual or Quad core CPU
- MCU Arm Cortex-M33
Memory and Storage
The SiP offers extensive flexibility in memory configuration with options ranging from 512 MB up to 8 GB of LPDDR4 RAMFor data storage and the operating system, it supports memory flash eMMC NAND with capacities of 4GB up to 64GB, complemented with options for flash SPI NOR for boot or configuration storage.
Network Interfaces and Peripherals
The connectivity is designed for demanding industrial environments. The module includes two 10/100/1000 Mbps Ethernet ports (Gigabit LAN), which facilitates integration into industrial networks. Regarding high-speed interfaces, it features a USB 3.2 port host y two USB 2.0 ports with Host/OTG support.
Multimedia and Graphics Capabilities
The MSRZG3E SiP is well-equipped to power HMI solutions with rich user experiences, supporting multiple displays and video input:
- Dual Video Output: It supports an interface MIPI-DSI for resolutions up to 1920 × 1200 at 60 frames per second, and a screen interface RGB for resolutions up to 1280 × 800 at 60 fps. This dual-screen capability is essential for complex workstations or control panels.
- Camera Entrance: For machine vision and monitoring, it includes a camera interface. MIPI-CSI with support for 1, 2 or 4 lanes.
- Video Codecs: The integrated multimedia processing unit handles the encoding and decoding of standards H.264 and H.265.
OSM Standardization and Physical Characteristics
One of the most notable features of the module is its compliance with the standard OSM (Open Standard Module) in size M (45 x 30 mm). This format uses a 476-pad ground grid array (LGA), allowing connectorless integration on the motherboard, which is ideal for reducing size and cost in space-constrained applications.
Peripherals and Expansion
Expandability is fundamental for embedded systems. The MSRZG3E offers:
- PCIe: One lane PCIe Gen3 x2 configurable as Root Complex or Endpoint.
- Industrial Interfaces: Multiple serial buses such as I²C, SPI, UART, and two interfaces CAN for communication in vehicle and automation environments.
- Analog Conversion: It includes a Analog-to-Digital Converter (ADC).
Temperature range
To ensure reliability in harsh environments, the module is offered in two temperature variants:
- Commercial Grade: 0°C to +70°C.
- Industrial Grade: -40 ° C to + 85 ° C.
With its technical specifications focused on performance, industrial robustness, and AI acceleration, the ARIES MSRZG3E offers a solid and standardized platform for the next generation of smart edge devices.